EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Teramount, the leader in scalable solutions for connecting optical fibers to silicon chips, announce […]
