YES Delivers First VertaCure™ XP to Leading Chinese OSAT Customer

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced its first shipment of the VertaCure™ XP vacuum curing system to a China-based OSAT customer. The system will support high volume manufacturing of flip chip and wafer-level packaging (WLP) applications. Multiple repeat orders […]

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