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		<title><![CDATA[EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits]]></title>
		<link>https://www.thaipr.net/en/it_en/3163112</link>
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		<pubDate>Thu, 03 Mar 2022 07:55:00 +0700</pubDate>
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					<description><![CDATA[<p>Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Teramount, the leader in scalable solutions for connecting optical fibers to silicon chips, announce [&#8230;]</p>
<p>The post <a rel="nofollow" href="https://www.thaipr.net/en/it_en/3163112">EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits</a> appeared first on <a rel="nofollow" href="https://www.thaipr.net">ThaiPR.NET</a>.</p>
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